Data center cooling
Cold plates with the lowest thermal resistance on the market
Copper foam breaks up the boundary layer and forces the coolant to mix. With far more heat-exchange surface than fins or microchannels, our single-phase cold plate stays ahead even at low flow, so you can run smaller pumps and simpler loops.
- Thermal resistance at 2 L/min
- 0.007 °C/W
- vs. high-performance fin designs
- ~70 % lower
- vs. commercial standard, >1 kW GPU/CPU
- +75 %
- Advantage holds down to
- 1 L/min
Next up: a two-phase cold plate with the highest nucleation site density of any comparable solution. We're looking for pilot partners.
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